The new wire bonder is a so called Wedge & Ball Bonder with motorized z and x axis, Ribbon is also possible. It has a simple operation with TFT touch screen with direct access and easy setting of all bonding parameters. It can be bonded with gold and aluminum wires. The wire bonder is HB16 Wedge & Ball Bonder from company tpt.
The new wire bonder comes through the working groups of Prof. Dr. Christian Ospelkaus, Prof. Dr. Boris Chichkov, and Prof. Dr. Tanja Mehlstäubler (Institute of Quantum Optics) and can be used by the LNQE working groups. If you need it, please contact the LNQE technology.
